L280-QSC1F20E006-120°規格書
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版本:2019-05-03

湖北深紫科技有限公司

產品規格書
SPECIFICATIONS

深紫外LED燈珠

L280-QSC1F20E006-120°

270~280nm,6~8mW@80mA,120°出光角,3737封裝

QSC1F20E006-120°

湖北深紫科技有限公司

Hubei DUVTek Co., LTD.

湖北省鄂州市梧桐湖新區鳳凰大道9號東湖高新科技創意城B08棟
Building B08, Donghu High-tech Innovation City, No. 9 Fenghuang Avenue, Wutong Lake New District, Ezhou, Hubei, China

  • 產品示意圖 Mechanical Specifications and Materials
  • 產品示意圖 Mechanical Specifications and Materials
    推薦PCB焊盤 Recommended pad for PCB

    建議PCB焊盤
    Recommended pad for PCB

    • 圖紙單位: mm
    • 封裝:3737封裝,外型尺寸:3.7×3.7×1.5 (L×W×H) [單位:mm]
    • 封裝材質:氮化鋁陶瓷支架,平面透鏡
    • 封裝芯片數量: pcs
    • 除非另有說明,公差為±0.10 mm
    • Unit: mm
    • LED Package: 3737 packaged, with size 3.7×3.7×1.5 (L×W×H) [Unit : mm]
    • Bracket material:Aluminum nitride ceramic
    • Chip inside: pcs
    • Tolerances unless otherwise mentioned are ± 0.10 mm
  • 光電特征參數 Typical Optical-Electrical Characteristics(Ta = 25 ℃)
  • Item Symbol Unit Value
    峰值波長 Peak Wavelength λp nm 270~280
    光功率 Radiant Flux P0 mW 6~8
    波峰半高寬 Full Width at Half Maximum Δλ nm 12
    驅動電流 Forward Current If mA 80
    工作電壓 Forward Voltage Vf V 5~7
    出光角 Viewing Half Angle 1/2 deg. 120
    熱阻 Thermal Resistance RΘj-b ℃/W 18
    最大工作電流 Max Forward Current Ifmax mA /
    • 這些數值由光譜分析儀和積分球測量系統測量。公差如下:工作電壓(Vf):±2%;光功率(P0):±10%;峰值波長(λp):±3.0 nm
    • 雖然所有的LED都是由我們的設備進行測試,但根據測試設備的條件,某些值可能會略有不同。
    • These values measured by Optical spectrum analyzer and integrating sphere measuring system. And tolerances are followings as below: Forward Voltage (Vf): ±2%, Radiant Flux (P0): ±10%, Peak Wavelength (λp): ±3.0 nm
    • Although all LEDs are tested by our equipment, some values may vary slightly depending on the conditions of the test equipment.
  • 光電參數圖例 Electro-Optical Characteristics
  • Card image cap
    Relative Intensity vs Peak Wavelength
    (If = 80 mA, Ta = 25 ℃)
    Card image cap
    Radiation Pattern
    (If = 80 mA, Ta = 25 ℃)
    Card image cap
    Normalized Light Output Power vs Ambient Temperature (If = 80 mA)
    無散熱條件下測試,實際使用環境應低于50℃
    Card image cap
    Forward Current vs Forward Voltage (Ta = 25 ℃)
    由于芯片特性不同,以上數據僅供參考
    Card image cap
    Normalized Light Output Power vs Current (Ta = 25 ℃)
    驅動電流與歸一化光功率的關系
  • 回流焊接 Reflow soldering profile
    • 回流焊接是在電路板上組裝LED的推薦方法。 DUVTek不保證通過浸焊方法組裝的LED的性能。
    • 推薦的焊接條件(Sn42/Ag1.0/Bi57,SMIC L23-BLT5-T8F)
    • Reflow soldering is the recommended method for assembling LEDs on a circuit board. DUVTek does not guarantee the performance of the LEDs assembled by the dip soldering method.
    • Recommended soldering conditions (Sn42/Ag1.0/Bi57, SMIC L23-BLT5-T8F)
    回流焊接 Reflow soldering profile
  • 防潮封裝注意事項 Moisture-Proof Package
    • 在焊接過程中,SMD封裝中的濕氣可能蒸發并膨脹。
    • 濕氣會損壞深紫外LED的光學特性。
    • The moisture in the SMD package may vaporize and expand during soldering.
    • The moisture can damage the optical characteristics of the DUV-LEDs due to the encapsulation.
  • 儲存及使用環境條件 Environmental conditions for storage and use
  • Item Symbol Unit Value
    使用溫度 Operating Temperature TOPR -30 ~ +60
    存儲溫度 Storage Temperature TSTG -30 ~ +100
    • 超出上述最大額定值操作,可能會影響器件的可靠性并造成永久性損壞。
    • DUV-LED不可以反向偏壓驅動。
    • Operating the DUV-LED beyond the listed maximum ratings may affect device reliability and cause permanent damage. These or any other conditions beyond those indicated under recommended operating conditions are not implied. The exposure to the absolute maximum rated conditions may affect device reliability.
    • The DUV-LEDs are not designed to be driven in reverse bias.
  • 儲存條件 During Storage
  • Conditions Temperature Humidity Time
    開封前 Before Opening Aluminum Bag 5~30 ℃ < 50%RH Within 1 Year from the Delivery Date
    開封后 After Opening Aluminum Bag 5~30 ℃ < 60%RH ≤ 672 hours
    烘干 Baking 65±5 ℃ < 10%RH 10~24 hours
  • 使用條件 During Usage
    • LED應避免直接接觸有害物質,如硫磺,氯氣,鄰苯二甲酸鹽等。
    • 在操作和儲存期間必須避免暴露于腐蝕性氣體。
    • 鍍銀金屬部件不僅受到最終產品內部排放的腐蝕性氣體的影響,還受到外部環境滲透的氣體的影響。
    • 必須避免可能導致冷凝的突發環境溫度變化或高濕度等極端環境。
    • The LED should avoid direct contact with hazardous materials such as sulfur, chlorine, phthalate, etc.
    • The metal parts on the LED can rust when exposed to corrosive gases. Therefore, exposure to corrosive gases must be avoided during operation and storage.
    • The silver-plated metal parts also can be affected not only by the corrosive gases emitted inside of the end-products but by the gases penetrated from outside environment.
    • Extreme environments such as sudden ambient temperature changes or high humidity that can cause condensation must be avoided.
  • 清洗注意事項 Cleaning
    • 請勿使用刷子清洗或用有機溶劑(即丙酮,TCE等)進行清洗,否則可能會損壞LED的樹脂。
    • 在以下條件下,異丙醇(IPA)是推薦用于清潔LED的溶劑。
    • 清潔條件:IPA,最高25℃。 ×60秒以內
    • 不建議使用超聲波清潔。
    • 預測試應與實際清潔過程一起進行,以驗證過程不會損壞LED。
    • Do not use brushes for cleaning or organic solvents (i.e. Acetone, TCE, etc..) for washing as they may damage the resin of the LEDs.
    • Isopropyl Alcohol(IPA) is the recommended solvent for cleaning the LEDs under the following conditions.
    • Cleaning Condition: IPA, 25℃ max. × 60sec max.
    • Ultrasonic cleaning is not recommended.
    • Pretests should be conducted with the actual cleaning process to validate that the process will not damage the LEDs.
  • 熱管理條件 Thermal Management
    • 熱管理是深紫外LED封裝冷卻性能中最重要的部分。
    • 即使從開始階段開始,也必須認真考慮產品的散熱設計。
    • 發熱量與輸入功率之間的協同效率受電路板熱阻以及LED布局與其他組件密度的影響。
    • 深紫外LED應焊接在具有高導熱性的金屬PCB上?;蛘哒垖⑸钭贤釲ED與金屬PCB、大容量散熱器(Heat Block),一個迷你(空氣或水冷卻器等組合在一起使用。
    • 請設計LED模塊或系統,使LED封裝的溫度不超過最大結溫(TJ)。
    • The thermal management is the most important thing of the hear dissipation(cooling) performance for the deep UV(UVC) LED Package.
    • The thermal design of the product must be seriously considered even from the beginning stage.
    • The co-efficiency between the heat generation and the input power is affected by the thermal resistance of the circuit boards and the density of the LED placements together with other components.
    • The deep UV(UVC) LED soldered on a metal PCB with a high thermal conductivity. Or Please combine the deep UV(UVC) LED with a metal PCB and a large volume-Heat Sink (Heat Block), a mini(compact / slim)-air or water cooler, etc.
    • Please design the LED module or system in customer that the temperature of the LED Package does not exceed the maximum junction temperature(TJ).
  • 靜電放電 Electrostatic Discharge (ESD)
    • LED對靜電或浪涌電壓和電流敏感。靜電放電可能會損壞LED芯片。而且,可以影響LED封裝壽命的可靠性。在處理LED時,積極推薦以下ESD措施:1)請佩戴手腕帶,防靜電衣服,腳穿和手套。2)請設置接地或防靜電的地板漆,接地或能夠浪涌保護工作站設備或電源,脈沖發生器,電流/電壓驅動電路等工具。3)ESD保護 - 工作臺/工作臺,由導電材料制成的墊子。
    • 產品裝配中使用的所有設備,設備和機器都需要接地。商業產品的設計時,請在審查后申請浪涌保護。
    • 如果工具或設備包含玻璃或塑料等絕緣材料,強烈建議采取以下措施:1)用導電材料消散靜電荷;2)防止水分產生電荷;3)插入離子風機(離子發生器)以中和電荷。
    • 建議客戶在執行時檢查LED是否被ESD損壞應用中LED的特性檢查。在低電流(≤1.0mA)下正向電壓檢測(測量)可檢測到LED損壞。
    • ESD損壞的LED可能會在低電壓下產生電流。*故障標準:在If = 0.5mA時Vf < 4.0V。
    • The LEDs are sensitive to static electricity or surge voltage and current. The Electrostatic Discharge can damage a LED Chip. Also, It can be affect a reliability belong to the life time of LED package. When handling LEDs, the following measures against ESD are actively recommended: 1) Please wear a wrist strap, anti-static clothes, foot wear and gloves. 2) Please set up a grounded or anti-static paint floors, a grounded or the ability to surge protection workstation equipment or power supply, pulse generator, current/voltage driver circuit, etc. and tools. 3) ESD protection- worktable/bench, mat made of conductive materials.
    • An appropriate grounding is required for all devices, equipment, and machinery used in product assembly. Please apply surge protection after review when designing of commercial products.
    • If tools or equipment contain insulating materials such as glass or plastics, the following measures against ESD are strongly recommended: 1) Dissipating static charge with conductive materials; 2) Preventing charge generation with moisture; 3) Plug in the ionizing blowers(ionizer) for neutralizing the charge.
    • The customer is advised to check if the LEDs are damaged by ESD when performing the characteristics inspection of the LEDs in the application. Damage of LED can be detected with a forward voltage checking(measuring) at low current (≤1.0 mA).
    • ESD damaged LEDs may have a current flow at a low voltage. * Failure Criteria: Vf < 4.0V at If= 0.5mA.
  • 人體防護 Human body protection
  • 人體防護 Human body protection
    • UVC倒裝芯片發射深紫外線,在其附近具有極高的輻射強度, 這樣可以快速消毒,但在此期間必須遵守安全預防措施裝配和測試。
    • 通過從制造商處購買UVC LED,客戶特此同意免除制造商因未能遵守本規范中的注意事項造成的任何身體傷害的責任。
    • 所有裝配工人,觀察員和旁觀者必須在進行眼睛和皮膚保護。
    • 禁止裸眼觀察(包括通過顯微鏡)和在操作中裸露處理UVC LED。UVC光線很容易被污染物吸收,所以不允許觸摸UVC芯片的藍寶石側面。
    • UVC flip chip emits deep ultraviolet radiation, with extremely high intensity near its surface. This allows rapid disinfection but safety precautions must be observed during assembly and testing.
    • By purchasing the UVC LEDs from the manufacturer, the customer hereby agrees to absolve the manufacture's responsibility of any bodily harm as a result of failure to observe the precautions, warnings and guidelines contained within this Specifications.
    • All assembly workers, observers and bystanders must wear eye and skin protection when the UVC LEDs are energized. Bare eye observation (including through microscopes) and bare-hand handling of a UVC LED in operation is PROHIBITED.
    • UVC light can be easily absorbed, so any oil or other absorbent liquid must NOT be allowed to touch the sapphire side of the UVC chip.

    深紫科技,芯片級深紫外LED殺菌技術開拓者